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Home ProductsWafer Connector

Dual Row Wafer Connector 4.2mm Pitch Right Angle Mini-Fit Header without Flange

Dual Row Wafer Connector 4.2mm Pitch Right Angle Mini-Fit Header without Flange

    • Dual Row Wafer Connector 4.2mm Pitch Right Angle Mini-Fit Header without Flange
    • Dual Row Wafer Connector 4.2mm Pitch Right Angle Mini-Fit Header without Flange
    • Dual Row Wafer Connector 4.2mm Pitch Right Angle Mini-Fit Header without Flange
  • Dual Row Wafer Connector 4.2mm Pitch Right Angle Mini-Fit Header without Flange

    Product Details:

    Place of Origin: Dongguan, China(mainland)
    Brand Name: HRT
    Certification: ISO9001/ ISO14001/UL/RoHS/REACH
    Model Number: C4255WR-2XNP

    Payment & Shipping Terms:

    Minimum Order Quantity: 5000pcs
    Price: negotiated
    Packaging Details: Reel, Tube(Pipe), Tape, Bag or as required
    Delivery Time: 5 to 8 working days after payment checked
    Payment Terms: TT, Western Union, PayPal, L/C
    Supply Ability: 28000K pcs per month
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    Detailed Product Description
    Category: Wafer Row No.: Dual
    Locking Structure: With Wire Range: AWG26# To 22#
    Application: Power, Wire To Board Matched Housing: C4255HF Series Dual Row
    High Light:

    Wafer Connector 2.0mm

    ,

    Housing Connector

    1, Detailed specification of product:
           1. Basic information:

    • Color: White
    • Housing Material: PA66 
    • Flammability: 94V-2
    • Pin material: Brass or tin-plated
    • Pitch: 4.20 mm
    • Circuits: 2 to 24 positions
    • Insulation O.D.: 3.10mm
    • Terminal materials: Phosphor bronze/Brass
    • Finish terminal: Tin-plated type

     
           2. Electrical characteristic:

    • Current Rating: 9A AC DC
    • Voltage Rating: 600V AC, DC
    • Contact Resistance: 10mΩ Max
    • Insulation Resistance: 1000MΩ
    • Withstanding Voltage:  1500V AC/minute

       
          3. Mechanical characteristic:

    • ​​Temperature Range:-25°C ~+85°C
    • Terminal Insertion Force: 1.50kgf (Max.)
    • Terminal/Housing Retention Force: 3.00kgf (Min.)
    • Pin Retention Force: 3.00kgf (Min.)
    • Latch Yield Strength:7.0kgf (Min.)
    • Panel Mount Retention Force: 16.0kgf (Min.)

     2, Related engineering drawing and testing report
    The attached picture is our standard engineering drawing and report for your reference, it will help you to 
    know our product feature, then you can choose the right models.
     

                                                             Dimension drawing                                                                                                         Dual Row Wafer Connector 4.2mm Pitch Right Angle Mini-Fit Header without Flange
     
                                                                      Testing report                                                           

    The detailed testing report will help you to know the performance of product, it can be your important reference.
     

    Environmental Performance And Others

     

    Test Description Procedure Requirement
    6-1 Temperature Rise Carrying rated current load.(Based upon UL 498) 30℃(Max.)
    6-2 Heat Resistance 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

    Appearance No Damage.

    Contact Resistance 20mΩ (Max.)

    6-3 Cold Resistance -25±3℃,96 hours (Based upon JIS C0020)
    6-4 Humidity

    Temperature: 40±2℃

    Relative Humidity : 90~95%

    Duration: 96 hours

    (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

    Appearance No Damage.

    Contact Resistance 20mΩ (Max.)

    Insulation Resistance 100MΩ (Min.)

    Dielectric Withstanding Voltage Must meet 4-3

    6-5 Temperature Cycling

    5 cycles of:

    a) -55℃ 30 minutes

    b) +85℃ 30 minutes

    (Based upon JIS C0025)

    Appearance No Damage.

    Contact Resistance 20mΩ (Max.)

    6-6 Salt Spray Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
    6-7 SO2 Gas

    24 hours exposure to 50±5ppm.

    SO2 gas at 40±2℃.

    6-8 NH3 Gas

    40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution

    6-9 Solderability

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 245±5℃

    Solder Wetting 95% of immersed area must show no voids, pin holes
    6-10 Resistance to Soldering Heat

    Solder pot method

    Soldering time: 10±0.5 sec.

    Solder Temperature: 260±5℃

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.

    3,The application of this series product

    Please kindly check the below picture, you can know its' applicated range directly. Our products are mainly used in wire to wire connecting, power, Inside of some machines and some appliances, or power of PCB board. By the way, all of this series prodcut are complied with REACH, UL, RoHS srandard. In order to protect the evironment furthur, some parts are halogen free.
     
     
    4, Introduction for this series products

    Please kindly notice that the C4255 series product, you can buy it as a set, then we will offer you reasonable price.
     

                                                                 C4255 series product
    Terminal C4255F-T and C4255M-T
     
    Connector Single row type C4255HF-NP & C4255HMNP & C4255HMA-NP
    Dual row type C4255HF-2XNP & C4255HM-2XNP & C4255HMA-2XNP
     
    Wafer Single row type C4255WV-NP & C4255WR-NP & C4255WR-F-NP(with foot)
    Dual row type C4255WV-2XNP & C4255WR-2XNP & C4255WR-F-2XNP(with foot)

     

    Contact Details
    RULETEAM CONNECTION TECHNOLOGY (SHENZHEN) CO.,LTD

    Contact Person: Tienne Chen

    Tel: +8613711905178

    Send your inquiry directly to us (0 / 3000)

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