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Home ProductsWire To Board Connectors

2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material

2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material

    • 2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material
    • 2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material
    • 2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material
  • 2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material

    Product Details:

    Place of Origin: Dongguan, China(mainland)
    Brand Name: HRT
    Certification: ISO9001/ ISO14001/UL/RoHS/REACH
    Model Number: A2546H-2XNP

    Payment & Shipping Terms:

    Minimum Order Quantity: 5000 pcs
    Price: Negotiated
    Packaging Details: Bag with outside carton
    Delivery Time: 5 to 8 working days after payment checked
    Payment Terms: TT, Western Union, PayPal, L/C
    Supply Ability: 28 million pcs per month
    Contact Now
    Detailed Product Description
    Category: Wire Housing Suitable Pin Header: A2546 Or A2548 Dual Row Series
    Suitable Terminals: A2545 Series Row: Dual/Double
    Position: 4 To 64 Pins Gender: Female
    High Light:

    Connector Wire To Board

    ,

    Pcb To Wire Connectors

     
    1, Detailed product characteristic

    Basic demission information
    Flammability UL94V-0
    Application Dual, wire-to-board
    Pitch 2.50mm
    Color Black
    Material PBT
    Bump With and without type available
    Wire range AWG22# to 28#
    Wire insulation diameter  1.63mm Max.
    Terminal materials Brass material, tin-plated or gold-flash finish
     
                                     Electrical properties
    Current Rating 3.0 A AC, DC
    Voltage Rating 250 V AC, DC
    Contact Resistance 20 mΩ Max
    Insulation Resistance 1000 MΩ min
    Withstanding Voltage 1500V AC/minute
     
                                     Mechanical properties
    Temperature range -25℃ to 85 ℃
          Other information please kindly check the following picture.

     
    2, Engineering drawing and testing report
    Folllowing pictures are out testing report and exact engineering drawing for your information, please kindly check it, wish it can help you to get what you really need.
                                                               
                                                                    With one nose type    

    2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material
     2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material

    2.50mm Pitch Wire To Board Connectors Double Row SMT Housinh Wafer With PBT Material
     

    Environmental Performance And Others

     

    Test Description Procedure Requirement
    6-1 Temperature Rise Carrying rated current load.(Based upon UL 498) 30℃(Max.)
    6-2 Heat Resistance 85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-3 Cold Resistance -25±3℃,96 hours (Based upon JIS C0020)
    6-4 Humidity

    Temperature: 40±2℃

    Relative Humidity : 90~95%

    Duration: 96 hours

    (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    Insulation Resistance 100MΩ (Min.)

    Dielectric Withstanding Voltage Must meet 4-3

    6-5 Temperature Cycling

    5 cycles of:

    a) -55℃ 30 minutes

    b) +85℃ 30 minutes

    (Based upon JIS C0025)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-6 Salt Spray Tin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
    6-7 SO2 Gas

    24 hours exposure to 50±5ppm.

    SO2 gas at 40±2℃.

    6-8 NH3 Gas 40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.
    6-9 Solderability

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 245±5℃

    Solder Wetting 95% of immersed area must show no voids, pin holes
    6-10

    Resistance to Soldering Heat

    (DIP)

    Solder pot method

    Soldering time: 10±0.5 sec.

    Solder Temperature: 260±5℃

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.
    6-11 Resistance to Soldering Heat (SMT)

    When reflowing

    Refer to paragraph 8

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.

                                                         
    3, Application fied of these product
    This product is designed and msde for PDP, LCD, or small electronics equipment. Because we can controll NPL ratio under a very low value, so our parts are accepted by famouse and international company like TPV, Emerson, Amphenol Corporation, Skyworth, etc. You can know this directly from the attached pictures. By the way, all product are approved by REACH, UL, RoHS. In order to protect the evironment, some parts are halogen free. 
     
     
    4, Our service
    We offer one-stop service for you, it will help you to make cost down.Our payment way is flexible according to order sales amount. 

     

    Q:Do you allow multiple design per setup?
    A:Yes.We accept OEM service and allow multiple design per setup.

    Q:How long does shipping take?
    A:It depends on the destination location and quantity. In most developed world, delivery by Fed x/UPS/DHL is normally 2-3 days(excluding weekends).

    Q: How is the goods packaged ?
    A: Usually in vacuum packages and carton box.

     

    Contact Details
    RULETEAM CONNECTION TECHNOLOGY (SHENZHEN) CO.,LTD

    Contact Person: Tienne Chen

    Tel: +8613711905178

    Send your inquiry directly to us (0 / 3000)

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