PA66 material 1.25mm pitch wire to board connector without locking structure

Product Details:

Place of Origin:	Dongguan, China(mainland)
Brand Name:	HRT
Certification:	ISO9001/ ISO14001/UL/RoHS/REACH
Model Number:	A1250H-NP

Payment & Shipping Terms:

Minimum Order Quantity:	5000 pcs
Price:	Negotiated
Packaging Details:	Bag with outside carton
Delivery Time:	5 to 8 working days after payment checked
Payment Terms:	TT, Western Union, PayPal, L/C
Supply Ability:	28 million pcs per month

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Detailed Product Description

Category:	Crimp Housings	Pitch:	1.25mm
Row:	Single	Color:	White
Gender:	Female	Stackable:	No
High Light:	Pcb To Wire Connectors , Board To Wire Connectors

1, The specification details table

Basic size information
Suitable terminals		A1250M series
Category		Crimp housings
Material		PA66/PBT
Flammability		UL94V-0
Lock to mating part		None
Panel mount		No
Circuits		2 to 16pins
Wire insulation diameter		0.90mm Max.

Electrical properties
Current Rating		1A AC, DC
Voltage Rating		125V AC, DC
Contact Resistance		20mΩ Max
Insulation Resistance		100mΩ min
Withstanding Voltage		500V AC/minute

Mechanical properties
Temperature range		-25℃ to 85 ℃
Other information please kindly check the following picture.

2, Related drawing and report

Folllowing pictures are out testing report and exact engineering drawing for your information, please kindly check it, wish it can help you to get what you really need.

PA66 material 1.25mm pitch wire to board connector without locking structure

5. Mechanical Performance

Test Description		Procedure	Requirement
5-1	Actuator Insertion & Withdrawal Force	Insert and withdraw connectors at the speed rate of 25±3mm / minute.	Refer to paragraph 7
5-2	Crimping Pull Out Force	Fix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8)	AWG#28	1.0kgf (Min)
			AWG#30	0.8kgf (Min)
			AWG#32	0.5kgf (Min)
5-3	Terminal Insertion Force.	Insert the crimped terminal into the housing.	0.50kgf (Max.)
5-4	Terminal/Housing Retention Force.	Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing.	0.50kgf (Min.)
5-5	Pin Retention Force	Apply axial push force at the speed rate of 25±3mm / minute	0.50kgf (Min.)
5-6	Durability	When mated up to 50 cycles repeatedly by the rate of 10 cycle per minute.	Contact Resistance 40mΩ (Max.)
5-7	Vibration	Amplitude: 1.5mm P-P Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes. (Based upon MIL-STD-202 Method 201A)	Appearance No Damage. Contact Resistance 40mΩ (Max.) Discontinuity 1 μsec.(Max.)
5-8	Physical Shock	490m/s²｛50G｝,3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

6. Environmental Performance And Others

Test Description		Procedure	Requirement
6-1	Temperature Rise	Carrying rated current load.(Based upon UL 498)	30℃(Max.)
6-2	Heat Resistance	85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-3	Cold Resistance	-25±3℃,96 hours (Based upon JIS C0020)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-4	Humidity	Temperature: 40±2℃ Relative Humidity : 90~95% Duration: 96 hours (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)	Appearance No Damage. Contact Resistance 40mΩ (Max.) Insulation Resistance 10MΩ (Min.) Dielectric Withstanding Voltage Must meet 4-3
6-5	Temperature Cycling	5 cycles of: a) -55℃ 30 minutes b) +85℃ 30 minutes (Based upon JIS C0025)	Appearance No Damage. Contact Resistance 40mΩ (Max.)
6-6	Salt Spray	Tin-plated 16 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101C Cond. B)
6-7	SO2 Gas	24 hours exposure to 50±5ppm. SO2 gas at 40±2℃.
6-8	NH3 Gas	40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.

6-9

Solderability

Soldering Time: 5±0.5 sec.

Solder Temperature: 245±5℃

Solder Wetting 95% of immersed area must show no voids, pin holes

6-10

Resistance to Soldering Heat

(DIP)

Solder pot method

Soldering time: 10±0.5 sec.

Solder Temperature: 260±5℃

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

6-11

Resistance to Soldering Heat (SMT)

When reflowing

Refer to paragraph 8

Solder iron method

Soldering Time: 5±0.5 sec.

Solder Temperature: 370℃ ~ 400℃

Appearance No Damage.

7. Actuator Insertion/Withdrawal Force

[Unit : kgf]

Circuits	At Initial		Circuits	At Initial
Circuits	Insertion (Max.)	Withdrawal (Min.)	Circuits	Insertion (Max.)	Withdrawal (Min.)
02	2.00	0.28	11	6.50	0.62
03	2.50	0.30	12	7.00	0.65
04	3.00	0.33	13	7.50	0.68
05	3.50	0.38	14	8.00	0.71
06	4.00	0.43	15	8.50	0.74
07	4.50	0.48	16	9.00	0.77
08	5.00	0.53	17	9.50	0.80
09	5.50	0.56	18	10.00	0.83
10	6.00	0.59

3, Application fied of these product

You can have a direct cognition from the attached picture about its' application. This product are widely used in household appliance, computer, communication device. Because we establish a strict quality inspection system, so our products are trusted by international renown company like TPV, LeTV, Emerson, Amphenol Corporation, Skyworth, BYD etc. And the all products are certificated by REACH, UL, RoHS. In order to protect the evironment, some parts are halogen free.

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Contact Person: Tienne Chen

Tel: +8613711905178